The LOFT pressurizer spray and surge line piping was analyzed for a 450/sup 0/F step change in fluid temperature. This transient was chosen to conservatively represent several pressurizer operating transients that had not previously been analyzed. These include temperature transients resulting from a 300/sup 0/F ..delta..T between pressurizer temperature and cold leg temperature, injection of a cooled (70/sup 0/F) slug of stagnant fluid into the hot (540/sup 0/F) spray line piping, and inflow of 100/sup 0/F primary coolant system water into the hot (480/sup 0/F) surge line piping.

The calculated performance of single stage and Venetian blind direct energy converters for Catalyzed D and D-/sup 3/He Tokamak reactors are discussed. Preliminary results on He pumping are outlined. The efficiency of D and T neutral beam injection is reviewed.

The new algorithm used to calculate the ponderomotive force in LASNEX is discussed. The algorithm is shown to be identical with the corresponding analytic expression when the WKB solution for the fields in a plane-parallel medium is used. LASNEX calculations performed to check the ponderomotive force algorithm are described. 2 figures.

Continuing studies of fission cross-section ratios at Lawrence Livermore Laboratory have led to the measurement of the /sup 243/Am//sup 235/U fission cross-section ratio from 0.1 to 30 MeV. A value of 1.429 +- 0.037 was obtained for the average cross-section ratio from 1.75 to 4.00 MeV by use of the threshold method. 2 figures, 1 table.

The multiblade slurry technique capable of slicing 10 cm ingot into wafers 0.25 mm thick with only 0.20 mm kerf loss and 98% yield has been demonstrated. The total silicon requirement represents an ingot to sheet conversion of 0.95 m/sup 2//kg. Full production slicing tests have demonstrated the cost of MS slicing to contribute $40 to $50/m/sup 2/, with ''best effort'' estimates for today's configuration to be $30 to $35/m/sup 2/. By reducing material cost, and increasing the specific capacity of a saw to slice 900 wafers simultaneously, the long-term cost of MS slicing is estimated to be less than $10/m/sup 2/. The conversion of ingot to sheet is shown to be the most valuable contribution of slicing technology. At today's ingot costs, and with the thin wafer, low kerf loss slicing techniques demonstrated, the silicon material represents 5 to 10 times the cost of the wafering process in finished silicon wafers. Increasing the number of blades used in MS slicing from 100 to 150 to 225 to 300 has resulted in a reduction of yield to 33 to 70% for thin slicing, or an increase in wafer thickness to 0.30 mm slices. The limitation is intrinsic misalignment of multiple …

This report provides necessary user information to implement and use a graphics package for the CORTES finite-element computer programs. Complete input instructions are provided. Sample input and output are given.