A method of fabricating a seal between a ceramic and an alloy comprising the steps of prefiring the alloy in an atmosphere with a very low partial pressure of oxygen, firing the assembled alloy and ceramic in air, and gradually cooling the fired assembly to avoid the formation of thermal stress in the ceramic. The method forms a bond between the alloy and the ceramic capable of withstanding the environment of a pressurized water reactor and suitable for use in an electrical conductivity sensitive liquid level transducer.