In situ remediation is an emerging technology that will play an important role in DOE's environmental restoration program, and is an area where enhancement in fundamental understanding will lead to significantly improved cleanup tools. In situ remediation technologies have inherent advantages because they do not require the costly removal, transport, and disposal of contamination. In addition, these technologies minimize worker exposure because contaminated materials are not brought to the surface. Finally, these technologies will minimize the generation of secondary waste streams with their associated treatment and disposal. A particularly promising in situ remediation technology is bioremediation. For inorganic contaminants such as radionuclides and metals, in situ bioremediation can be used to alter the mobility or reduce the toxicity of radionuclides and metals by changing the valence state of the radionuclides and metals, degrading or producing complexing ligands, or facilitating partitioning on to or off of solid phases. The purpose of the research presented here was to explore microbially facilitated partitioning of metal and radionuclides by their co-precipitation with calcium carbonate. Although this approach is a very attractive cleanup alternative, its practical implementation requires improved scientific understanding of the geochemical and biological mechanisms involved, particularly with respect to rates and mechanisms …

Low dimensional systems on the nanometer scale afford a wealth of interesting possibilities including highly anisotropic behavior and quantum effects. Nanocolumns permit electrical and mechanical contact, yet benefit from two confined dimensions. This confinement leads to new optical, mechanical, electrical, chemical, and magnetic properties. We construct nanocolumn arrays with precise definition and independent control of diameter, length, orientation, areal density and composition so that geometry can be directly correlated to the quantum physical property of interest. The precision and control are products of the fabrication technique that we use. The process starts with an ion of sufficient energy to ''track'' a dielectric such as a film applied uniformly onto a substrate. The energy loss of the ion alters chemical bonding in the dielectric along the ion's straight trajectory. A suitable etchant quickly dissolves the latent tracks leaving high aspect ratio holes of small diameter ({approx}10nm) penetrating a film as thick as several microns. These small holes are interesting and useful in their own right and can be made to any desired size by continuing the etching process. Moreover, they serve as molds for electrochemical filling. After this electro-deposition, the mold material can be removed leaving the columns firmly attached to …