The major sources of power dissipation in a nanometer CMOS circuit are capacitive switching, short-circuit current, static leakage and gate oxide tunneling. However, with the aggressive scaling of technology the gate oxide direct tunneling current (gate leakage) is emerging as a prominent component of power dissipation. For sub-65 nm CMOS technology where the gate oxide (SiO2) thickness is very low, the direct tunneling current is the major form of tunneling. There are two contribution parts in this thesis: analytical modeling of behavioral level components for direct tunneling current and propagation delay, and the reduction of tunneling current during behavioral synthesis. Gate oxides of multiple thicknesses are useful in reducing the gate leakage dissipation. Analytical models from first principles to calculate the tunneling current and the propagation delay of behavioral level components is presented, which are backed by BSIM4/5 models and SPICE simulations. These components are characterized for 45 nm technology and an algorithm is provided for scheduling of datapath operations such that the overall tunneling current dissipation of a datapath circuit under design is minimal. It is observed that the oxide thickness that is being considered is very low it may not remain constant during the course of fabrication. Hence …