Materials properties of ruthenium and ruthenium oxides thin films for advanced electronic applications.

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Ruthenium and ruthenium dioxide thin films have shown great promise in various applications, such as thick film resistors, buffer layers for yttrium barium copper oxide (YBCO) superconducting thin films, and as electrodes in ferroelectric memories. Other potential applications in Si based complementary metal oxide semiconductor (CMOS) devices are currently being studied. The search for alternative metal-based gate electrodes as a replacement of poly-Si gates has intensified during the last few years. Metal gates are required to maintain scaling and performance of future CMOS devices. Ru based materials have many desirable properties and are good gate electrode candidates for future metal-oxide-semiconductor (MOS) device applications. Moreover, Ru and RuO2 are promising candidates as diffusion barriers for copper interconnects. In this thesis, the thermal stability and interfacial diffusion and reaction of both Ru and RuO2 thin films on HfO2 gate dielectrics were investigated using Rutherford backscattering spectrometry (RBS), X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). An overview of Ru and RuO2/HfO2 interface integrity issues will be presented. In addition, the effects of C ion modification of RuO2 thin films on the physico-chemical and electrical properties are evaluated.
Date: May 2006
Creator: Lim, ChangDuk
System: The UNT Digital Library

Characterization of Methyltrimethoxysilane Sol-Gel Polymerization and the Resulting Aerogels.

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Methyl-functionalized porous silica is of considerable interest as a low dielectric constant film for semiconductor devices. The structural development of these materials appears to affect their gelation behaviors and impact their mechanical properties and shrinkage during processing. 29Si solution NMR was used to follow the structural evolution of MTMS (methyltrimethoxysilane) polymerization to gelation or precipitation, and thus to better understand the species that affect these properties and gelation behaviors. The effects of pH, water concentration, type of solvents, and synthesis procedures (single step acid catalysis and two-step acid/base catalysis) on MTMS polymerization were discussed. The reactivity of silicon species with different connectivity and the extent of cyclization were found to depend appreciably on the pH value of the sol. A kinetic model is presented to treat the reactivity of both silicon species involved in condensations separately based on the inductive and steric effects of these silicon species. Extensive cyclization in the presence of acid, which was attributed to the steric effects among numerous reaction pathways for the first time, prevents MTMS gelation, whereas gels were obtained from the two-step method with nearly random condensations. The experimental degree of condensation (DC) at the gel point using the two-step procedure was determined …
Date: August 2003
Creator: Dong, Hanjiang
System: The UNT Digital Library

Mechanical behavior and performance of injection molded semi-crystalline polymers.

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I have used computer simulations to investigate the behavior of polymeric materials at the molecular level. The simulations were performed using the molecular dynamics method with Lennard-Jones potentials defining the interactions between particles in the system. Significant effort was put into the creation of realistic materials on the computer. For this purpose, an algorithm was developed based on the step-wise polymerization process. The resulting computer-generated materials (CGMs) exhibit several features of real materials, such as molecular weight distribution and presence of chain entanglements. The effect of the addition of a liquid crystalline (LC) phase to the flexible matrix was also studied. The concentration and distribution of the second phase (2P) were found to influence the mechanical and tribological properties of the CGMs. The size of the 2P agglomerates was found to have negligible influence on the properties within the studied range. Moreover, although the 2P reinforcement increases the modulus, it favors crack formation and propagation. Regions of high LC concentration exhibit high probability of becoming part of the crack propagation path. Simulations of the tensile deformation under a uniaxial force have shown that the molecular deformation mechanisms developing in the material depend on several variables, such as the magnitude of …
Date: August 2003
Creator: Simoes, Ricardo J. F.
System: The UNT Digital Library

Application of Thermomechanical Characterization Techniques to Bismuth Telluride Based Thermoelectric Materials

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The thermoelectric properties of bismuth telluride based thermoelectric (TE) materials are well-characterized, but comparatively little has been published on the thermomechanical properties. In this paper, dynamic mechanical analysis (DMA) and differential scanning calorimetry data for bismuth telluride based TE materials is presented. The TE materials' tan delta values, indicative of viscoelastic energy dissipation modes, approached that of glassy or crystalline polymers, were greater than ten times the tan delta of structural metals, and reflected the anisotropic nature of TE materials. DMA thermal scans showed changes in mechanical properties versus temperature with clear hysteresis effects. These results showed that the application of DMA techniques are useful for evaluation of thermophysical and thermomechanical properties of these TE materials.
Date: August 2002
Creator: White, John B.
System: The UNT Digital Library

Fabrication of MOS capacitor and transitor structure using contact photolithography.

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This problem in lieu of thesis report describes a practical photolithographic method to produce micro patterns on metal-oxide-semiconductor or metal-oxide-semiconductor-metal layers for electrical measurements. The desired patterns are then transferred from the photo mask to the photoresist-coated metal film by exposure, followed by wet etching. In the procedure described in this report, it was observed that microstructures as small as 27 mm with an edge roughness of ~ 2 mm can be reproducibly generated with this process. MOS capacitors and transistors structures can be fabricated by using this technique. The method described in this report requires access to only simple facilities so that it is relatively inexpensive, and the overall time required for the whole process is short.
Date: August 2002
Creator: Su, Danni
System: The UNT Digital Library

Mechanical Properties of Polymer Modified Mortar

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The mechanical properties of the polymer-modified mortar are markedly improved over conventional cement mortar. We utilized recycled ABS in powder form and a polymer latex emulsion, polymer percentage ranges from 0 to 25 percent by polymer/cement ratio were investigated. The mechanical properties investigated were compression strength and adhesion strength. Compression strength effects did not have an impact on adhesion strength. Adhesion strength was calculated with pullout testing apparatus designed by the author. Results indicate that recycled ABS had a lower adhesive strength than the acrylic latex emulsion and the base mortar, but did increase in adhesive strength when mixed with maleic-anhydride. The adhesive strength was investigated for a Fiber Reinforced Polymer (FRP) made of an "E" glass fiber that is a continuous strand roving oriented and pre-tensioned longitudinally in an isopthalic polyester matrix material. The FRP rebar was compared to standard steel rebars, and found that the standard steel corrugated rebar had a higher adhesive strength, due to mechanical interlocking. This was clarified by measurements using a smooth steel rebar. Characterization of the polymer-modified mortar was conducted by pore analysis and scanning electron microscopy. Scanning Electron Microscopy was implemented to view the polymer particles, the cement fibrils formed by the …
Date: August 2002
Creator: Palos, Artemio
System: The UNT Digital Library

Characterizaton of Triethoxyfluorosilane and Tetraethoxysilane Based Aerogels

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Aerogels are highly porous, low dielectric constant (low k) materials being considered by the semiconductor industry as an interlayer dielectric. Low k materials are needed to overcome capacitance problems that limit device feature sizes. Precursors triethoxyfluorosilane (TEFS) and tetraethoxysilane (TEOS) were used to prepare bulk aerogels. Samples were prepared by sol-gel methods, and then carbon dioxide supercritically-dried. Effects of varying the water to precursor ratio were studied with respect to aerogel properties and microstructure. Methods of analysis for this study include FTIR-ATR, TEM, RBS, EDS, SEM, dielectric constant determination by impedance and surface area by gas adsorption. Si-F bonds were determined to be present in both acid- and base-catalyzed TEFS as well as HF-catalyzed TEOS. Fluorine promotes a fractal network microstructure as opposed to a particle-like microstructure. Surface area and dielectric constant were determined to increase slightly with increases in the water to precursor ratio.
Date: December 2001
Creator: Roepsch, Jodi Ann
System: The UNT Digital Library

The Effects of Color Concentrate in Polyolefins.

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Throughout history consumer products were generally manufactured from wood and metal. They either had to hold their natural color or become subject to painting. When plastics entered the industry, it was recognized for its ease of shaping, re-usability, physical properties and its low cost. One of plastics' greatest benefits is its ability to hold a given color from within allowing it to avoid use of paint. This paper will give a brief overview on the effects of pigments when incorporated in a polyolefin. It will provide a classification of the main types of pigments and how each effect the properties of the product through: crystallization, weatherability, opacity, coloristic values and of course viscosity.
Date: December 2001
Creator: Flora, Paul
System: The UNT Digital Library

Mineral-filled polypropylene: Improvement of scratch resistance

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A potential alternative to acrylonitrile-butadiene-styrene (ABS) and polycarbonate+ABS (PC+ABS), pigmented mineral-filled polypropylene (PP) finds an opening in automotive interior components such as instrument panels, knee bolsters, consoles, etc. Because of the lack of surface aesthetics, pigmented mineral-filled PP is experiencing a limitation to its acceptance in many applications. This study focuses on exploring various mineral fillers and additives in polypropylene to provide a material with enhanced scratch resistance. Several physical properties including Rockwell and Shore D hardness are investigated, and it is determined that Filler W improves scratch resistance. It is also determined that Filler T-filled-PP has poor scratch resistance even with the addition of a lubricant.
Date: December 2001
Creator: Khatib, Jamal F.
System: The UNT Digital Library

Thermal, Electrical, and Structural Analysis of Graphite Foam

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A graphite foam was developed at Oak Ridge National Laboratory (ORNL) by Dr. James Klett and license was granted to POCO Graphite, Inc. to manufacture and market the product as PocoFoam™. Unlike many processes currently used to manufacture carbon foams, this process yields a highly graphitic structure and overcomes many limitations, such as oxidation stabilization, that are routinely encountered in the development of carbon foam materials. The structure, thermal properties, electrical resistivity, isotropy, and density uniformity of PocoFoam™ were evaluated. These properties and characteristics of PocoFoam™ are compared with natural and synthetic graphite in order to show that, albeit similar, it is unique. Thermal diffusivity and thermal conductivity were derived from Fourier's energy equation. It was determined that PocoFoam™ has the equivalent thermal conductivity of metals routinely used as heat sinks and that thermal diffusivity is as much as four times greater than pure copper and pure aluminum. SEM and XRD results indicate that PocoFoam™ has a high degree of crystalline alignment and near theoretical d spacing that is more typical of natural flake graphite than synthetic graphite. PocoFoam™ is anisotropic, indicating an isotropy factor of 0.5, and may yield higher thermal conductivity at cryogenic temperatures than is observed in …
Date: August 2001
Creator: Morgan, Dwayne Russell
System: The UNT Digital Library

Cure Kinetics and Processing Parameters of Neat and Reinforced High Performance Epoxy Resins: Evaluation of Techniques

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Kinetic equation parameters for the curing reaction of a commercial glass fiber reinforced high performance epoxy prepreg composed of the tetrafunctional epoxy tetraglycidyl 4,4-diaminodiphenyl methane (TGDDM), the tetrafunctional amine curing agent 4,4’-diaminodiphenylsulfone (DDS) and an ionic initiator/accelerator, are determined by various thermal analysis techniques and the results compared. The reaction is monitored by heat generated determined by differential scanning calorimetry (DSC). The changes in physical properties indicating increasing conversion are followed by shifts in glass transition temperature determined by DSC and temperature-modulated DSC (TMDSC), thermomechanical (TMA) and dynamic mechanical (DMA) analysis and thermally stimulated depolarization (TSD). Changes in viscosity, also indicative of degree of conversion, are monitored by DMA. Thermal stability as a function of degree of cure is monitored by thermogravimetric analysis (TGA). The parameters of the general kinetic equations, including activation energy and rate constant, are explained and used to compare results of various techniques. The utilities of the kinetic descriptions are demonstrated in the construction of a useful time-temperature-transformation (TTT) diagram for rapid determination of processing parameters in the processing of prepregs. Copyright is held by the author, unless otherwise noted. All rights reserved. Files: Thesis.pdf Special Conditions
Date: December 1999
Creator: Bilyeu, Bryan
System: The UNT Digital Library