Using Motor Electrical Signature Analysis to Determine the Mechanical Condition of Vane-Axial Fans (open access)

Using Motor Electrical Signature Analysis to Determine the Mechanical Condition of Vane-Axial Fans

The purpose of this research was a proof of concept using a fan motor stator as transducer to monitor motor rotor and attached axial fan for mechanical motion. The proof was to determine whether bearing faults and fan imbalances could be detected in vane-axial fans using Motor Electrical Signature Analysis (MESA). The data was statistically analyzed to determine if the MESA systems could distinguish between baseline conditions and discrete fault frequencies for the three test conditions: bearing inner race defect, bearing outer race defect, and fan imbalance. The statistical conclusions for these proofs of concept were that MESA could identify all three faulted conditions.
Date: August 2002
Creator: Doan, Donald Scott
System: The UNT Digital Library
Characterization of Boron Nitride Thin Films on Silicon (100) Wafer. (open access)

Characterization of Boron Nitride Thin Films on Silicon (100) Wafer.

Cubic boron nitride (cBN) thin films offer attractive mechanical and electrical properties. The synthesis of cBN films have been deposited using both physical and chemical vapor deposition methods, which generate internal residual, stresses that result in delamination of the film from substrates. Boron nitride films were deposited using electron beam evaporation without bias voltage and nitrogen bombardment (to reduce stresses) were characterize using FTIR, XRD, SEM, EDS, TEM, and AFM techniques. In addition, a pin-on-disk tribological test was used to measure coefficient of friction. Results indicated that samples deposited at 400°C contained higher cubic phase of BN compared to those films deposited at room temperature. A BN film containing cubic phase deposited at 400°C for 2 hours showed 0.1 friction coefficient.
Date: August 2007
Creator: Maranon, Walter
System: The UNT Digital Library
Factors influencing horizontal cracking in continuously reinforced concrete pavements (CRCP). (open access)

Factors influencing horizontal cracking in continuously reinforced concrete pavements (CRCP).

This research presents the results on an experimental investigation to identify the significant factors influencing horizontal cracking in continuously reinforced concrete pavements (CRCP). An in-depth analysis of the microstructure, morphological characteristics of the interfacial transition zone (ITZ) and the observation of cracking using the environmental scanning electron microscope (ESEM) was done. Characterization of oxides using Fourier transform infrared spectroscopy (FTIR) and electron dispersive x-ray spectroscopy (EDS) was also performed. Water to cement ratio (w/c) and rebar temperature had a significant influence on the rebar-concrete bond strength. The 28-day shear strength measurements showed an increase in rebar-concrete bond strength as the water to cement ratio (w/c) was reduced from 0.50 to 0.40. There was a reduction in the peak pullout load as the temperature increased from 14oF to 252oF for the corroded and non-corroded rebar experiments. The corroded rebar pullout test results showed a 20-50 % reduction in bond strength compared to the non-corroded rebars. FTIR measurements indicated a presence of lepidocrocrite (γ -FeOOH) and maghemite (γ -Fe2O3) on the ITZ. ESEM images showed the existence of microcracks as early as three days after casting with the bridging of these cracks between coarse aggregate locations in the interfacial zone propagating through …
Date: August 2008
Creator: Sudoi, Elias K.
System: The UNT Digital Library
A Verilog 8051 Soft Core for FPGA Applications (open access)

A Verilog 8051 Soft Core for FPGA Applications

The objective of this thesis was to develop an 8051 microcontroller soft core in the Verilog hardware description language (HDL). Each functional unit of the 8051 microcontroller was developed as a separate module, and tested for functionality using the open-source VHDL Dalton model as benchmark. These modules were then integrated to operate as concurrent processes in the 8051 soft core. The Verilog 8051 soft core was then synthesized in Quartus® II simulation and synthesis environment (Altera Corp., San Jose, CA, www.altera.com) and yielded the expected behavioral response to test programs written in 8051 assembler residing in the v8051 ROM. The design can operate at speeds up to 41 MHz and used only 16% of the FPGA fabric, thus allowing complex systems to be designed on a single chip. Further research and development can be performed on v8051 to enhance performance and functionality.
Date: August 2009
Creator: Rangoonwala, Sakina
System: The UNT Digital Library
FEM of nanoindentation on micro- and nanocrystalline Ni: Analysis of factors affecting hardness and modulus values. (open access)

FEM of nanoindentation on micro- and nanocrystalline Ni: Analysis of factors affecting hardness and modulus values.

Nanoindentation is a widely used technique to measure the mechanical properties of films with thickness ranging from nanometers to micrometers. A much better understanding of the contact mechanics is obtained mostly through finite element modeling. The experiments were modeled using the software package Nano SP1 that is based on COSMOSM™ (Structural Research & Analysis Corp, www.cosmosm.com), a finite element code. The fundamental material properties affecting pile-up are the ratio of the effective modulus to yield stress Eeff/σ and the work hardening behavior. Two separate cases of work hardening rates were considered; one with no work hardening rate and other with a linear work hardening rate. Specifically, it is observed that pile up is large only when hf/hmax is close to one and degree of work hardening rate is small. It should also be noted that when hf/hmax < 0.7 very little pile-up is observed no matter what the work-hardening behavior of the material. When pile-up occurs the contact area is greater than that predicted by the experimental methods and both the hardness and modulus are overestimated. In this report the amount by which these properties are overestimated are studied and got to be around 22% approx. Bluntness of the tip …
Date: August 2005
Creator: Pothapragada, Raja Mahesh
System: The UNT Digital Library