This report describes the activities on the ''Ultra Miniaturization of RF'' project conducted as part of Sandia's Laboratory Directed Research and Development (LDRD) program. The objective was to evaluate a multichip module technology known as Microwave Chip on Flex (MCOF) [1], which is a newer form of the standard high density interconnect (HDI) technology originally developed by General Electric and Lockheed Martin [2,3]. The program was a three-year effort. In the first year, the team focused on understanding the technology and developing a basic design library. In the second year, devices and interconnects used at L, X, and Ku frequency bands were evaluated via a test coupon (with no application specific circuit design). In the third year, we designed, fabricated, and evaluated a specific Ku-band circuit. The circuit design and layout was performed by Sandia, and the module fabrication was performed by Lockheed Martin Government Electronic Systems. In MCOF technology [1], bare die are placed face down on an adhesive backed flex circuit. The first level of the circuit is a pre-patterned titanium copper thin film metal system on a polyimide dielectric material. The complete module is then framed and filled with an epoxy encapsulant. The module is flipped and …

The Pacific Northwest National Laboratory Institutional Plan for FY 2000-2004 sets forth the laboratory's mission, roles, technical capabilities, and laboratory strategic plan. In the plan, major initiatives also are proposed and the transitioning initiatives are discussed. The Programmatic Strategy section details our strategic intent, roles, and research thrusts in each of the U.S. Department of Energy's mission areas. The Operations/Infrastructure Strategic Plan section includes information on the laboratory's human resources; environment, safety, and health management; safeguards and security; site and facilities management; information resources management; management practices and standards; and communications and trust.

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