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Using Motor Electrical Signature Analysis to Determine the Mechanical Condition of Vane-Axial Fans (open access)

Using Motor Electrical Signature Analysis to Determine the Mechanical Condition of Vane-Axial Fans

The purpose of this research was a proof of concept using a fan motor stator as transducer to monitor motor rotor and attached axial fan for mechanical motion. The proof was to determine whether bearing faults and fan imbalances could be detected in vane-axial fans using Motor Electrical Signature Analysis (MESA). The data was statistically analyzed to determine if the MESA systems could distinguish between baseline conditions and discrete fault frequencies for the three test conditions: bearing inner race defect, bearing outer race defect, and fan imbalance. The statistical conclusions for these proofs of concept were that MESA could identify all three faulted conditions.
Date: August 2002
Creator: Doan, Donald Scott
System: The UNT Digital Library
Characterization of Boron Nitride Thin Films on Silicon (100) Wafer. (open access)

Characterization of Boron Nitride Thin Films on Silicon (100) Wafer.

Cubic boron nitride (cBN) thin films offer attractive mechanical and electrical properties. The synthesis of cBN films have been deposited using both physical and chemical vapor deposition methods, which generate internal residual, stresses that result in delamination of the film from substrates. Boron nitride films were deposited using electron beam evaporation without bias voltage and nitrogen bombardment (to reduce stresses) were characterize using FTIR, XRD, SEM, EDS, TEM, and AFM techniques. In addition, a pin-on-disk tribological test was used to measure coefficient of friction. Results indicated that samples deposited at 400°C contained higher cubic phase of BN compared to those films deposited at room temperature. A BN film containing cubic phase deposited at 400°C for 2 hours showed 0.1 friction coefficient.
Date: August 2007
Creator: Maranon, Walter
System: The UNT Digital Library
FEM of nanoindentation on micro- and nanocrystalline Ni: Analysis of factors affecting hardness and modulus values. (open access)

FEM of nanoindentation on micro- and nanocrystalline Ni: Analysis of factors affecting hardness and modulus values.

Nanoindentation is a widely used technique to measure the mechanical properties of films with thickness ranging from nanometers to micrometers. A much better understanding of the contact mechanics is obtained mostly through finite element modeling. The experiments were modeled using the software package Nano SP1 that is based on COSMOSM™ (Structural Research & Analysis Corp, www.cosmosm.com), a finite element code. The fundamental material properties affecting pile-up are the ratio of the effective modulus to yield stress Eeff/σ and the work hardening behavior. Two separate cases of work hardening rates were considered; one with no work hardening rate and other with a linear work hardening rate. Specifically, it is observed that pile up is large only when hf/hmax is close to one and degree of work hardening rate is small. It should also be noted that when hf/hmax < 0.7 very little pile-up is observed no matter what the work-hardening behavior of the material. When pile-up occurs the contact area is greater than that predicted by the experimental methods and both the hardness and modulus are overestimated. In this report the amount by which these properties are overestimated are studied and got to be around 22% approx. Bluntness of the tip …
Date: August 2005
Creator: Pothapragada, Raja Mahesh
System: The UNT Digital Library