Presentation about compressed natural gas in municipal fleets, assessing investment profitability, the VICE model, base-case scenarios, and pressing questions for fleet owners.

This presentation was delivered at the ASHRAE 2010 Annual Summer Conference on June 27, 2010, and addresses humidity and AC loads in energy efficient houses.

Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of cooling technologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and identifying potential thermal control technologies for the package. The results can help users select the appropriate combination of packaging configuration and cooling technology for the desired application.