The running costs of data centers are dominated by the need to dissipate heat generated by thousands of server machines. Higher temperatures are undesirable as they lead to premature silicon wear-out; in fact, mean time to failure has been shown to decrease exponentially with temperature (Black's law). Although other server components also generate heat, microprocessors still dominate in most server configurations and are also the most vulnerable to wearout as the feature sizes shrink. Even as processor complexity and technology scaling have increased the average energy density inside a processor to maximally tolerable levels, modern microprocessors make extensive use of hardware structures such as the load-store queue and other CAM-based units, and the peak temperatures on chip can be much worse than even the average temperature of the chip. In recent studies, it has been shown that hot-spots inside a processor can generate {approx} 800W/cm{sup 2} heat flux whereas the average heat flux is only 10-50W/cm{sup 2}, and due to this disparity in heat generation, the temperature in hot spots may be up to 30 C more than average chip temperature. The key problem processor hot-spots create is that in order to prevent some critical hardware structures from wearing out …

This article's study endeavors to determine if p53 is responsible for cisplatin sensitization by NSC109268. Results have implications for sensitivity of ovarian cancer cells to cisplatin independent of p53.