Temperature dependent rheology of surfactant-hydroxypropyl cellulose solutions. (open access)

Temperature dependent rheology of surfactant-hydroxypropyl cellulose solutions.

The rheology of 1-8% hydroxypropyl cellulose (HPC) solutions has been studied in the temperature range of 20-45 degrees Celsius. The results showed that the relative viscosity at each HPC concentration decreases with increasing temperature. The relative viscosity decreases drastically at about 43 degrees Celsius due to a phase transition. The influence of anionic surfactant, sodium dodecylsulfate (SDS), induced gelation of a 2% HPC solution. The HPC solutions gelled at surfactant SDS concentrations ranging from 0.4 to 1.0 critical micelle concentration (CMC). The gelation of the HPC/SDS hydrogel is explained in the surfactant SDD - bridged HPC linear polymer chains. The complex viscosity - concentration profile was determined below the CMC of the SDS - water pair. The peak itself was a function of frequency indicating the presence of two relaxation times within the gelled network.
Date: December 2002
Creator: Snively, C. Todd
System: The UNT Digital Library
Stability of Field Emitter Arrays to Oxygen Exposures (open access)

Stability of Field Emitter Arrays to Oxygen Exposures

The purpose of these experiments was to determine the degradation mechanisms of molybdenum based field emitter arrays to oxygen exposures and to improve the overall reliability. In addition, we also evaluated the emission current stability of gold-coated field emitter arrays to oxygen exposures. oxygen at 1x10-6 torr was introduced into the chamber through a leak valve for different lengths of time and duty cycles. To ensure identical oxygen exposure and experimental measurement conditions, tips on half the area of the FEA were fully coated with gold and the other half were left uncoated. The emission current from the gold coated half was found to degrade much less than that from the uncoated half, in the presence of oxygen. Also in the absence of oxygen, the emission current recovery for the gold-coated side was much quicker than that for the uncoated side.
Date: December 2002
Creator: Godbole, Soumitra Kumar
System: The UNT Digital Library

Application of Thermomechanical Characterization Techniques to Bismuth Telluride Based Thermoelectric Materials

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The thermoelectric properties of bismuth telluride based thermoelectric (TE) materials are well-characterized, but comparatively little has been published on the thermomechanical properties. In this paper, dynamic mechanical analysis (DMA) and differential scanning calorimetry data for bismuth telluride based TE materials is presented. The TE materials' tan delta values, indicative of viscoelastic energy dissipation modes, approached that of glassy or crystalline polymers, were greater than ten times the tan delta of structural metals, and reflected the anisotropic nature of TE materials. DMA thermal scans showed changes in mechanical properties versus temperature with clear hysteresis effects. These results showed that the application of DMA techniques are useful for evaluation of thermophysical and thermomechanical properties of these TE materials.
Date: August 2002
Creator: White, John B.
System: The UNT Digital Library

Fabrication of MOS capacitor and transitor structure using contact photolithography.

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This problem in lieu of thesis report describes a practical photolithographic method to produce micro patterns on metal-oxide-semiconductor or metal-oxide-semiconductor-metal layers for electrical measurements. The desired patterns are then transferred from the photo mask to the photoresist-coated metal film by exposure, followed by wet etching. In the procedure described in this report, it was observed that microstructures as small as 27 mm with an edge roughness of ~ 2 mm can be reproducibly generated with this process. MOS capacitors and transistors structures can be fabricated by using this technique. The method described in this report requires access to only simple facilities so that it is relatively inexpensive, and the overall time required for the whole process is short.
Date: August 2002
Creator: Su, Danni
System: The UNT Digital Library

Mechanical Properties of Polymer Modified Mortar

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The mechanical properties of the polymer-modified mortar are markedly improved over conventional cement mortar. We utilized recycled ABS in powder form and a polymer latex emulsion, polymer percentage ranges from 0 to 25 percent by polymer/cement ratio were investigated. The mechanical properties investigated were compression strength and adhesion strength. Compression strength effects did not have an impact on adhesion strength. Adhesion strength was calculated with pullout testing apparatus designed by the author. Results indicate that recycled ABS had a lower adhesive strength than the acrylic latex emulsion and the base mortar, but did increase in adhesive strength when mixed with maleic-anhydride. The adhesive strength was investigated for a Fiber Reinforced Polymer (FRP) made of an "E" glass fiber that is a continuous strand roving oriented and pre-tensioned longitudinally in an isopthalic polyester matrix material. The FRP rebar was compared to standard steel rebars, and found that the standard steel corrugated rebar had a higher adhesive strength, due to mechanical interlocking. This was clarified by measurements using a smooth steel rebar. Characterization of the polymer-modified mortar was conducted by pore analysis and scanning electron microscopy. Scanning Electron Microscopy was implemented to view the polymer particles, the cement fibrils formed by the …
Date: August 2002
Creator: Palos, Artemio
System: The UNT Digital Library
Influence of design and coatings on the mechanical reliability of semiconductor wafers. (open access)

Influence of design and coatings on the mechanical reliability of semiconductor wafers.

We investigate some of the mechanical design factors of wafers and the effect on strength. Thin, solid, pre-stressed films are proposed as a means to improve the bulk mechanical properties of a wafer. Three-point bending was used to evaluate the laser scribe density and chemical processing effect on wafer strength. Drop and strike tests were employed to investigate the edge bevel profile effect on the mechanical properties of the wafer. To characterize the effect of thin films on strength, one-micron ceramic films were deposited on wafers using PECVD. Coated samples were prepared by cleaving and were tested using four-point bending. Film adhesion was characterized by notched four-point bending. RBS and FTIR were used to obtain film chemistry, and nanoindentation was used to investigate thin film mechanical properties. A stress measurement gauge characterized residual film stress. Mechanical properties of the wafers correlated to the residual stress in the film.
Date: August 2002
Creator: Yoder, Karl J.
System: The UNT Digital Library
Hypotheses for Scratch Behavior of Polymer Systems that Recover (open access)

Hypotheses for Scratch Behavior of Polymer Systems that Recover

Scratch recovery is a desirable property of many polymer systems. The reason why some materials have demonstrated excellent scratch recovery while others do not has been a mystery. Explaining the scratch resistance based upon the hardness of a material or its crosslink density is incorrect. In this thesis, novel polymers were tested in an attempt to discover materials that show excellent scratch recovery - one of the most important parameters in determining the wear of a material. Several hypotheses were developed in an attempt to give an accurate picture of how the chemical structure of a polymer affects its scratch recovery. The results show that high scratch recovery is a complex phenomenon not solely dependent upon the presence of electronegative atoms such as fluorine.
Date: May 2002
Creator: Bujard, Bernard
System: The UNT Digital Library