Two types of solder samples, pins and through-holes were tested by SERA™ (Sequential Electrochemical Reduction Analysis) and Wetting Balance after various length of steamaging treatment. It was shown that after steam-aging, both types of specimen gave a similar electrochemical reduction curve, and solderabilty predictions made from SERA™ test agree with results obtained from Wetting Balance test on a qualitative base. Wetting balance test of pin samples after SERA™ test confirmed that SERA™ is a non-destructive testing method -- it even restored solderability. Comparison of electrochemical reduction behavior of samples under different treatment indicates that steam-aging can not reproduce exactly the effect of naturally atmospheric aging, and may not be the best artificial accelerating environment adopted.

The purpose of this study was to determine the factors affecting the acid degradation of chrysotile asbestos (Mg_3Si_2O_5(OH_4)) . Millions of tons of asbestos have found use in this country as insulative or ablative material. More than 95 percent of the asbestos in use is of the chrysotile variety. The remaining 5 percent is composed of various types of fibrous amphiboles. The inhalation of asbestos can lead to several diseases in humans. Asbestosis, lung cancer and mesothelioma are the most common afflictions associated with asbestos inhalation, and they may occur up to 40 years after the initial exposure. It has previously been reported that if more than 50 percent of the magnesium is removed from a chrysotile sample its carcinogenicity is reduced to nil. Several inorganic acids were studied to determine their ability to leach magnesium from chrysotile. It was found that the ability to leach magnesium was dependent upon the acidic anion in addition to the concentration of the acid. The ordering of the efficiency of the acids in their ability to remove magnesium from chrysotile was found to be HCl > H_2SO_4 > H_3PO_4 > HNO_3. Predictive equations were developed to allow the calculation of the amount of …

The Sn/Pb eutectic alloy system is the most widely used joining material in the electronics industry. In this application, the solder acts as both an electrical and mechanical connection within and among the different packaging levels in an electronic device. Recent advances in packaging technologies, however, driven by the desire for miniaturization and increased circuit speed, result in severe operating conditions for the solder connection. In an effort to improve its mechanical integrity, metallic or intermetallic particles have been added to eutectic Sn/Pb solder, and termed composite solders. It was the goal of this study to investigate the growth and morphology of the two intermetallic phases (Cu6Sn5 and Cu3Sn) that form between a Cu substrate and Sn/Pb solder under different aging and annealing conditions.

The determination of carbon monoxide is also possible by trapping CO on preconditioned molecular sieve and thermal desorption. Analysis in this case is performed by gas chromatography/mass spectroscopy, although the trapping technique is applicable to other suitable GC techniques.