Degree Department

Month

Scaling Behaviors and Mechanical Properties of Polymer Gels (open access)

Scaling Behaviors and Mechanical Properties of Polymer Gels

Polymer gels undergo a volume phase transition in solvent in response to an infinitesimal environmental change. This remarkable phenomenon has resulted in many potential applications of polymer gels. The understanding of its mechanical properties has both scientific and technological importance. For this purpose, we have developed a novel method for measuring Poisson's ratio, which is one of the most important parameters determining the mechanical property of gels. Using this method, Poisson's ratio in N-isopropyacrylamide (NIPA) and polyacrylamide (PAAM) gels has been studied.
Date: May 1994
Creator: Li, Chʻun-fang
System: The UNT Digital Library
Transport Processes in Synchrotrons (open access)

Transport Processes in Synchrotrons

This thesis examines the evolution of beams in synchrotrons. Following an introduction to accelerator physics in Chapter 1, in Chapter 2 I describe the Fermilab E778 'diffusion' experiment. Families of sextupoles were powered to drive the 2/5 resonance, and a beam was then kicked to populate a nonlinear region of the transverse phase space. The beam was then observed over periods of approximately 30 minutes for a variety of kick amplitudes and physical apertures. In Chapter 3 comments about the analytic treatment of such systems are discussed, including the assumptions inherent in the conventional treatment. I motivate my use of a simplified model in Chapter 4 after examining common computational methods. Deriving the model from the formalism of traditional accelerator physics, I discuss its implementation on a massively parallel computer, the Intel iPSC/860 hypercube, and examine the performance of this algorithm in detail. Using the simple model to perform the numerical experiment equivalent to E778 is the subject of Chapter 5. I derive the parameters needed for the simple model based upon the physical experiment. Both three dimensional cases and cases with reduced dimensionality are run. From power supply ripple data and an electrical model of the magnet string, I …
Date: May 1994
Creator: Cole, Benjamin H. (Benjamin Holland)
System: The UNT Digital Library
Nonlinear Dynamics of Semiconductor Device Circuits and Characterization of Deep Energy Levels in HgCdTe by Using Magneto-Optical Spectroscopy (open access)

Nonlinear Dynamics of Semiconductor Device Circuits and Characterization of Deep Energy Levels in HgCdTe by Using Magneto-Optical Spectroscopy

The nonlinear dynamics of three physical systems has been investigated. Diode resonator systems are experimentally shown to display a period doubling route to chaos, quasiperiodic states, periodic locking states, and Hopf bifurcation to chaos. Particularly, the transition from quasiperiodic states to chaos in line-coupled systems agrees well with the Curry-Yorke model. The SPICE program has been modified to give realistic models for the diode resonator systems.
Date: May 1994
Creator: Yü, Chi
System: The UNT Digital Library
Diffusion Kinetics and Microstructure of Eutectic and Composite Solder/Copper Joints (open access)

Diffusion Kinetics and Microstructure of Eutectic and Composite Solder/Copper Joints

Sn/Pb solders are widely used by the electronics industry to provide both mechanical and electrical interconnections between electronic components and printed circuit boards. Solders with enhanced mechanical properties are required for high reliability for Surface Mount Technology (SMT) applications. One approach to improve the mechanical properties of solder is to add metallic or intermetallic particles to eutectic 63Sn/37Pb solder to form composite solders. Cu6Sn5 and Cu3Sn form and grow at the solder/copper substrate interface. The formation and growth of these intermetallics have been proposed as controlling mechanisms for solderability and reliability of solder/copper joints. The goal of this study was to investigate the diffusion kinetics and microstructures of six types of composite solder/copper joints.
Date: May 1994
Creator: Wu, Yujing
System: The UNT Digital Library