Since their invention in the mid-1960's, surface acoustic wave (SAW) devices have become popular for a wide variety of applications. SAW devices represent a low-cost and compact method of achieving a variety of electronic signal processing functions at high frequencies, such as RF filters for TV or mobile wireless communications [1]. SAW devices also provide a convenient platform in chemical sensing applications, achieving extremely high sensitivity to vapor phase analytes in part-per-billion concentrations [2]. Although the SAW acoustic mode can be created on virtually any crystalline substrate, the development of SAW technology has historically focused on the use of piezoelectric materials, such as various orientations of either quartz or lithium niobate, allowing the devices to be fabricated simply and inexpensively. However, the III-V compound semiconductors, and GaAs in particular, are also piezoelectric as a result of their partially covalent bonding and support the SAW acoustic mode, allowing for the convenient fabrication of SAW devices. In addition, GaAs microelectronics has, in the past decade, matured commercially in numerous RF wireless technologies. In fact, GaAs was recognized long ago as a potential candidate for the monolithic integration of SAW devices with microelectronics, to achieve compact RF signal processing functions [3]. The details …

Proton implantation in GaN is found to reduce the free carrier density through two mechanisms - first, by creating electron and hole traps at around Ec-0.8eV and Ev+0.9eV that lead to compensation in both n- and p-type material, and second, by leading to formation of (AH)O complexes, where A is any acceptor (Mg, Ca, Zn, Be, Cd). The former mechanism is usefid in creating high resistivity regions for device isolation, whereas the latter produces unintentional acceptor passivation that is detrimental to device performance. The strong affinity of hydrogen for acceptors leads to markedly different redistribution behavior for implanted in n- and p-GaN due to the chemical reaction to form neutral complexes in the latter. The acceptors may be reactivated by simple annealing at 2600{degrees}C, or by electron injection at 25-150{degrees}C that produces debonding of the (AH) centers. Implanted hydrogen is also strongly attracted to regions of strain in heterostructure samples during annealing, leading to pile-up at epi-epi and epi-substrate interfaces. II? spectroscopy shows that implanted hydrogen also decorates VG, defects in undoped and n-GaN.