Design of systems in the low-end nanometer domain has introduced new dimensions in power consumption and dissipation in CMOS devices. With continued and aggressive scaling, using low thickness SiO2 for the transistor gates, gate leakage due to gate oxide direct tunneling current has emerged as the major component of leakage in the CMOS circuits. Therefore, providing a solution to the issue of gate oxide leakage has become one of the key concerns in achieving low power and high performance CMOS VLSI circuits. In this thesis, a new approach is proposed involving dual dielectric of dual thicknesses (DKDT) for the reducing both ON and OFF state gate leakage. It is claimed that the simultaneous utilization of SiON and SiO2 each with multiple thicknesses is a better approach for gate leakage reduction than the conventional usage of a single gate dielectric (SiO2), possibly with multiple thicknesses. An algorithm is developed for DKDT assignment that minimizes the overall leakage for a circuit without compromising with the performance. Extensive experiments were carried out on ISCAS'85 benchmarks using 45nm technology which showed that the proposed approach can reduce the leakage, as much as 98% (in an average 89.5%), without degrading the performance.

The major sources of power dissipation in a nanometer CMOS circuit are capacitive switching, short-circuit current, static leakage and gate oxide tunneling. However, with the aggressive scaling of technology the gate oxide direct tunneling current (gate leakage) is emerging as a prominent component of power dissipation. For sub-65 nm CMOS technology where the gate oxide (SiO2) thickness is very low, the direct tunneling current is the major form of tunneling. There are two contribution parts in this thesis: analytical modeling of behavioral level components for direct tunneling current and propagation delay, and the reduction of tunneling current during behavioral synthesis. Gate oxides of multiple thicknesses are useful in reducing the gate leakage dissipation. Analytical models from first principles to calculate the tunneling current and the propagation delay of behavioral level components is presented, which are backed by BSIM4/5 models and SPICE simulations. These components are characterized for 45 nm technology and an algorithm is provided for scheduling of datapath operations such that the overall tunneling current dissipation of a datapath circuit under design is minimal. It is observed that the oxide thickness that is being considered is very low it may not remain constant during the course of fabrication. Hence …