The ability to bond together two or more silicon wafers greatly expands the variety and complexity of silicon microstructures that can be designed and fabricated. At LLNL, microstructures have been used for many years as hardware in scientific experiments. The activity has recently been expanded into other areas to include microinstruments for biomedical applications and for chemical analysis. Both high temperature (1100{degrees}C) bonding techniques have been used, depending on the application. This paper discusses these applications with emphasis on the most extensive which is the fabrication of microchannel coolers for diode arrays.

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