Two demonstrations of silicon slicing were made for solar cell application. 10 cm ingots of silicon were sliced into 225 wafers (full saw capacity) with over 94 percent yield in both cases. Wafers 0.48 mm thick were sliced with 0.25 mm kerf loss in 19 hours. The slice thickness duplicated currently used wafers. The second demonstration produced 0.30 mm thick slices with 0.25 mm kerf loss in 24 hours. This represents a current best effort with process conditions developed under this contract. Wafer surface damage is shown to be a fine microcrack structure which reduces to a faceted surface topography with 4 ..mu..m of etching. Abrasive particles used in MS sawing do not exhibit particle size degradation or wear of sharp edges. However, built-up silicon debris may effectively blunt cutting edges of the abrasive. Kerf loss was reduced to 0.20 mm in slicing a 10 cm ingot into 0.25 mm slices. This reduces the total silicon requirement per slice by 50 ..mu... Plans include the demonstration of full production capacity with the 0.15 mm thick blades used in this case and a cost analysis of MS sawing for solar cell applications. Limits of wafer thickness (250 ..mu..) and kerf loss …