Lead-tin plating can be rapidly and uniformly applied to a 0.25 in. square copper conductor. Such plating can be used as solder with a minimum flux requirement. In the range studied, the tin content of the coating can be controlled. It varies directly with the tin content of the bath and amperage and inversely with the temperature.

A high speed imaging system based on state-of-the-art photosensor arrays has been designed for use in nuclear diagnostics. The system is comprised of a front-end rapid-scan solid-state camera, a high speed digitizer, and a PCM line driver in a downhole package and a memory buffer system in a uphole trailer. The downhole camera takes a ''snapshot'' of a nuclear device created flux stream, digitizes the image and transmits it to the uphole memory system before being destroyed. The memory system performs two functions: it retains the data for local display and processing by a microprocessor, and it buffers the data for retransmission at slower rates to the LLL computational facility (NADS). The impetus for such a system as well as its operation are discussed. Also discussed are new systems under development which incorporate higher data rates and more resolution.